Andrew Technologies, Inc.
is an Electronic Contract Manufacturer
Specializing inCircuit Board Assembly Services
CapabilitiesCircuit Board Assembly
ServicesPortfoliosMetal Core PCB for
Industrial LightingSolder Mask on
Transistor for Transportation
Communication IndustryCustom Manufacturing of
FR-4 Circuit Board for the
Consumer IndustryCustom Manufacturing of
FR-4 Circuit Board for the
Commercial Industry
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Andrew Technologies Circuit Board Assembly featuring Through-Hole or Surface Mount Technology

Circuit Board Assembly ServicesAs a provider of circuit board assembly services, Andrew Technologies, Inc. works with rigid board constructions, featuring through-hole and surface mount technology to meet circuit board needs for commercial, industrial controls, power distribution boards, and other electronics, telecommunications, medical and manufacturing applications. Our facility features semi-automated assembly, working with board thicknesses from 0.031" to 0.25", from 1 board layer to 24 board layers. Our wave soldering capabilities range from 1.5" wide up to 18" wide, while our reflow soldering capabilities range from 0.5" to 18" wide.

Circuit assembly features that we are experienced in achieving include fine pitch, surface mount, BGA, QFP, QFN, and micro-BGA. We also provide extensive secondary and support services, including device programming, functional testing, solder screen printing, minor cable assemblies, and x-ray. We can provide rework or modification of existing circuit boards as well. In addition, we can provide special packaging for your finished products. Contact Andrew Technologies for more information.

Circuit Board Assembly Services Specifications:

General Capabilities Just-In-Time
Offshore
Prototypes
Industry Focus
Key Tracking
Industrial Controls
Power Distribution Boards
Electronics		 Manufacturing
Medical
Telecommunications
Industry Standards ISO 9001:2008
International Organization for Standardization
Circuit Board Construction
Rigid Boards Only
Copper Clad
Double-Sided
Etched
Metal Core Insulated
Mixed Technology (SMT and Thru Hole)		 Multilayer
Plated-Through-Hole (PTH)
Silver Through Hole
Single-Sided
Solder Mask Over Bare Copper (SMOBC)
Surface Mount
Materials
FR-4
Getek
Mylar		 Polyester
Polyimide
Teflon
Number of Board Layers Typically Worked With
Min
1 layers		 Max
24 layers
Circuit Board Features
Fine Line
Flush Surface
Lead Free		 PCI
Plug-In
Assembly Methods
Semi Automated Assembly
Hand Insertion
Hand Soldering		 Reflow
Wave Solder
Additional Services Provided
Board Fabrication
Programming
Component Sourcing		 Conformal Coating
Contract Manufacturing
Production Volume
Min
1 units 		Max
N/A
Desired File Format
AutoCAD (DWG)
Gerber
NC Drill Files		 PADS-PCB
Wave Soldering Width
Min
1.5 in		 Max
18 in
Reflow Width
Min
0.5 in 		Max
18 in
Thickness
Min
0.031 in 		Max
0.25 in

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